The project aims to tailor the internal structure of thin electrochemically deposited films for advanced applications. EBSD analysis supplemented by ion imaging is a useful tool for characterizing special (twin) boundaries in the nanostructured films. In addition, complete three-dimensional (3D) quantitative information on the internal structure of the films is essential for well directed grain boundary engineering. Conventional 2D EBSD mapping can be extended into the third dimension by successive serial sectioning using FIB milling. The complete microstructure characterization by 3D EBSD including local orientation relations between grains, the spatial distribution of the grain size, shape and crystallographic orientation and boundary types will allow tailoring functional properties of the films.
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