Study of slice thickness dependence on focused ion beam milling depth for quantitative 3D-Image analyses

Alice Bastos da Silva Fanta
Jakob Birkedal Wagner
One technique for studying microstructures in three dimension is based on successively acquiring image of the sample surface followed by the removal of a thin layer of the sample by focused ion beam milling and stacking all those images together to rebuild the microstructure in 3D. This technique can be applied to, for example, quantitative characterization of porous materials, diagnostic and failure analysis of semiconductors or connectivity of neurons in brain tissues, among others. However the reconstruction of the microstructure and its quantification relies on the precision of the slice thickness obtained in such technique. The thickness of the slices depends on the chosen microscope parameters, on the material used, and on the distance from the sample surface (the depth of the milling). In this project one will study and calibrate the slice thickness dependence on microscope parameters and on the depth of the milling by means of studying 3D data acquired on known films deposited on a sample surface with characteristic patterns.

 

Alice Bastos da Silva Fanta
Senior Researcher
DTU Cen
+45 45 25 64 69
Jakob Birkedal Wagner
Professor, Scientific director
DTU Cen
+45 45 25 64 71
http://www.cen.dtu.dk/english/research/projects/new-study-of-slice-thickness-dependence
22 SEPTEMBER 2017